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Properties of ultrathin platinum deposited by atomic layer deposition for nanoscale copper-metallization schemes
Properties of ultrathin platinum deposited by atomic layer deposition for nanoscale copper-metallization schemes
Properties of ultrathin platinum deposited by atomic layer deposition for nanoscale copper-metallization schemes
Zhu, Y. (Autor:in) / Dunn, K. A. (Autor:in) / Kaloyeros, A. E. (Autor:in)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 22 ; 1292-1298
01.01.2007
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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