Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Thermal fatigue performance of Sn-Ag-Cu chip-scale package with underfill
Thermal fatigue performance of Sn-Ag-Cu chip-scale package with underfill
Thermal fatigue performance of Sn-Ag-Cu chip-scale package with underfill
Noh, B. I. (Autor:in) / Lee, B. Y. (Autor:in) / Jung, S. B. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 483/484 ; 464-468
01.01.2008
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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