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Evolution of the Microstructure in Electrochemically Deposited Copper Films at Room Temperature
Evolution of the Microstructure in Electrochemically Deposited Copper Films at Room Temperature
Evolution of the Microstructure in Electrochemically Deposited Copper Films at Room Temperature
Pantleon, K. (Autor:in) / Somers, M. A. J. (Autor:in) / Kang, S.-J. L. / Huh, M. Y. / Hwang, N. M. / Homma, H. / Ushioda, K. / Ikuhara, Y.
Recrystallization and Grain Growth III PART 2 ; 1261-1264
MATERIALS SCIENCE FORUM ; 558/559
01.01.2007
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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