Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Evolution of the Microstructure in Electrochemically Deposited Copper Films at Room Temperature

    New search for: Pantleon, K.
    New search for: Somers, M. A. J.
    New search for: Kang, S.-J. L.
    New search for: Huh, M. Y.
    New search for: Hwang, N. M.
    New search for: Homma, H.
    New search for: Ushioda, K.
    New search for: Ikuhara, Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Evolution of the Microstructure in Electrochemically Deposited Copper Films at Room Temperature

    New search for: Pantleon, K.
    New search for: Somers, M. A. J.
    New search for: Kang, S.-J. L.
    New search for: Huh, M. Y.
    New search for: Hwang, N. M.
    New search for: Homma, H.
    New search for: Ushioda, K.
    New search for: Ikuhara, Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Evolution of the Microstructure in Electrochemically Deposited Copper Films at Room Temperature

    New search for: Pantleon, K.
    New search for: Somers, M. A. J.
    New search for: Kang, S.-J. L.
    New search for: Huh, M. Y.
    New search for: Hwang, N. M.
    New search for: Homma, H.
    New search for: Ushioda, K.
    New search for: Ikuhara, Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Evolution of the Microstructure in Electrochemically Deposited Copper Films at Room Temperature

    Contributors:

    Pantleon, K. (author) / Somers, M. A. J. (author) / Kang, S.-J. L. / Huh, M. Y. / Hwang, N. M. / Homma, H. / Ushioda, K. / Ikuhara, Y.

    Published in:

    Recrystallization and Grain Growth III PART 2 ; 1261-1264

    MATERIALS SCIENCE FORUM ; 558/559

    Publication date:

    2007-01-01

    Size:

    4 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Microstructure formation in electrochemically deposited Copper thin films

    Kremmer, K. / Yezerska, O. / Schreiber, G. et al. | British Library Online Contents | 2007

    Self-Similarity of Electrochemically-Deposited Copper Films on Porous Silicon

    Chen, L.L. / Zhai, B.G. / Huang, Y.M. | British Library Online Contents | 2010

    Electrochemically Deposited Copper for ULSI Technology

    Shacham-Diamand, Y. / Electrochemical Society; Electrodeposition Division | British Library Conference Proceedings | 1995

    X-Ray Diffraction Investigation of Electrochemically Deposited Copper

    Pantleon, K. / Jensen, J. D. / Somers, M. A. J. | British Library Online Contents | 2004

    Abnormal Grain Growth in Electrochemically Deposited Cu Films

    Militzer, M. / Freundlich, P. / Bizzotto, D. | British Library Online Contents | 2004

    Back to top