Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Effects of Zn addition on the drop reliability of Sn-3.5Ag-xZn/Ni(P) solder joints
Effects of Zn addition on the drop reliability of Sn-3.5Ag-xZn/Ni(P) solder joints
Effects of Zn addition on the drop reliability of Sn-3.5Ag-xZn/Ni(P) solder joints
Jee, Y. K. (Autor:in) / Yu, J. (Autor:in) / Ko, Y. H. (Autor:in)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 22 ; 2776-2784
01.01.2007
9 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Effect of La addition on adhesive strength and fracture behavior of Sn-3.5Ag solder joints
| British Library Online Contents | 2011
Tungsten alloying of the Ni(P) films and the reliability of Sn-3.5Ag/NiWP solder joints
| British Library Online Contents | 2011
Secondary IMC formation induced by Kirkendall voiding in Cu/Sn-3.5Ag solder joints
| British Library Online Contents | 2010
Heat-treatment to suppress the formation of Kirkendall voids in Sn-3.5Ag/Cu solder joints
| British Library Online Contents | 2013
Indentation creep of lead-free Sn–3.5Ag solder alloy: Effects of cooling rate and Zn/Sb addition
| British Library Online Contents | 2013