Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Tungsten alloying of the Ni(P) films and the reliability of Sn-3.5Ag/NiWP solder joints
Tungsten alloying of the Ni(P) films and the reliability of Sn-3.5Ag/NiWP solder joints
Tungsten alloying of the Ni(P) films and the reliability of Sn-3.5Ag/NiWP solder joints
Jang, D.M. (Autor:in) / Yu, J. (Autor:in)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 26 ; 889-895
01.01.2011
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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