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Study on the Mechanical Bend Fatigue of Micro-Joining Soldered Joint with Lead-Free Solder

Qi, F.J. / Huo, L.X. / Ding, Y.P. / Ding, Z.L.

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Study on the Mechanical Bend Fatigue of Micro-Joining Soldered Joint with Lead-Free Solder

Qi, F.J. / Huo, L.X. / Ding, Y.P. / Ding, Z.L.

Study on the Mechanical Bend Fatigue of Micro-Joining Soldered Joint with Lead-Free Solder

Qi, F.J. / Huo, L.X. / Ding, Y.P. / Ding, Z.L.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

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Dokumentinformationen

Ähnliche Titel

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Dokumentinformationen

Titel:

Study on the Mechanical Bend Fatigue of Micro-Joining Soldered Joint with Lead-Free Solder

Beteiligte:

Qi, F.J. (Autor:in) / Huo, L.X. (Autor:in) / Ding, Y.P. (Autor:in) / Ding, Z.L. (Autor:in) / Zhou, Y. / Tu, S.-T. / Xie, X.

Erschienen in:

Progresses in Fracture and Strength of Materials and Structures: Part 4: Selected, peer reviewed papers from the Asian Pacific Conference Fracture and Strength 2006 (APCFS'06), held at Sanya, Hainan Island, China during November 22˜25, 2006 ; 2573-2576

KEY ENGINEERING MATERIALS ; 353/358

Erscheinungsdatum:

01.01.2007

Format / Umfang:

4 pages

ISSN:

1013-9826

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

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