Thermal fatigue performance of Sn-Ag-Cu chip-scale package with underfill

Noh, B. I. / Lee, B. Y. / Jung, S. B. | British Library Online Contents | 2008

Reliability of Sn-Ag-Cu Flip Chip Package with Underfill under Thermal Shock

Noh, B. I. / Jung, S. B. | British Library Online Contents | 2006

Numerical analysis of plastic encapsulated electronic package reliability: Viscoelastic properties of underfill resin

Sham, M. L. / Kim, J. K. / Park, J. H. | British Library Online Contents | 2007

Design Considerations for Package Water Treatment Systems

DeMers, Larry D. / Hanzon, Boyd D. / Glick, Frank L. et al. | Wiley | 1988

Reliability Evaluation of Underfill Encapsulated Pb-Free Flip Chip Package under Thermal Shock Test

Kim, D. G. / Kim, J. W. / Ha, S. S. et al. | British Library Online Contents | 2007