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Thermal fatigue performance of Sn-Ag-Cu chip-scale package with underfill

Noh, B. I. / Lee, B. Y. / Jung, S. B.

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Thermal fatigue performance of Sn-Ag-Cu chip-scale package with underfill

Noh, B. I. / Lee, B. Y. / Jung, S. B.

Thermal fatigue performance of Sn-Ag-Cu chip-scale package with underfill

Noh, B. I. / Lee, B. Y. / Jung, S. B.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

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Document information

Title:

Thermal fatigue performance of Sn-Ag-Cu chip-scale package with underfill

Contributors:

Noh, B. I. (author) / Lee, B. Y. (author) / Jung, S. B. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING A ; 483/484 ; 464-468

Publication date:

2008-01-01

Size:

5 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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