Correlation between interfacial reactions and shear strengths of Sn-Ag-(Cu and Bi-In)/ENIG plated Cu solder joints: Fid-Bau Portal

Correlation between interfacial reactions and shear strengths of Sn-Ag-(Cu and Bi-In)/ENIG plated Cu solder joints

Yoon, J. W. / Chun, H. S. / Jung, S. B.

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Correlation between interfacial reactions and shear strengths of Sn-Ag-(Cu and Bi-In)/ENIG plated Cu solder joints

Yoon, J. W. / Chun, H. S. / Jung, S. B.

Correlation between interfacial reactions and shear strengths of Sn-Ag-(Cu and Bi-In)/ENIG plated Cu solder joints

Yoon, J. W. / Chun, H. S. / Jung, S. B.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

Seitennavigation

Dokumentinformationen

Ähnliche Titel

Exportieren, teilen und zitieren

Dokumentinformationen

Titel:

Correlation between interfacial reactions and shear strengths of Sn-Ag-(Cu and Bi-In)/ENIG plated Cu solder joints

Beteiligte:

Yoon, J. W. (Autor:in) / Chun, H. S. (Autor:in) / Jung, S. B. (Autor:in)

Erschienen in:

MATERIALS SCIENCE AND ENGINEERING A ; 483/484 ; 731-734

Erscheinungsdatum:

01.01.2008

Format / Umfang:

4 pages

ISSN:

0921-5093

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

Yoon, J. W. / Jung, S. B. | British Library Online Contents | 2006

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Yoon, J.-W. / Chun, H.-S. / Jung, S.-B. | British Library Online Contents | 2005

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Yi, Sung | British Library Online Contents | 2014

Interfacial morphology and shear deformation of flip chip solder joints

Jang, J. W. / Liu, C. Y. / Kim, P. G. et al. | British Library Online Contents | 2000

TEM observation of interfacial compounds of SnAgCu/ENIG solder bump after laser soldering and subsequent hot air reflows

Liu, Baolei / Tian, Yanhong / Liu, Wei et al. | British Library Online Contents | 2016

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