Interfacial Reaction and Mechanical Characterization of Eutectic Sn-Zn/ENIG Solder Joints during Reflow and Aging: Fid-Bau Portal

Interfacial Reaction and Mechanical Characterization of Eutectic Sn-Zn/ENIG Solder Joints during Reflow and Aging

Yoon, J.-W. / Chun, H.-S. / Jung, S.-B.

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Interfacial Reaction and Mechanical Characterization of Eutectic Sn-Zn/ENIG Solder Joints during Reflow and Aging

Yoon, J.-W. / Chun, H.-S. / Jung, S.-B.

Interfacial Reaction and Mechanical Characterization of Eutectic Sn-Zn/ENIG Solder Joints during Reflow and Aging

Yoon, J.-W. / Chun, H.-S. / Jung, S.-B.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

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Dokumentinformationen

Titel:

Interfacial Reaction and Mechanical Characterization of Eutectic Sn-Zn/ENIG Solder Joints during Reflow and Aging

Beteiligte:

Yoon, J.-W. (Autor:in) / Chun, H.-S. (Autor:in) / Jung, S.-B. (Autor:in)

Erschienen in:

Special Issue on Lead-Free Soldering in Electronics III ; 2386-2393

MATERIALS TRANSACTIONS ; 46

Erscheinungsdatum:

01.01.2005

Format / Umfang:

8 pages

ISSN:

1345-9678

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

Yoon, J. W. / Kim, S. W. / Jung, S. B. | British Library Online Contents | 2005

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Yoon, J. W. / Chun, H. S. / Jung, S. B. | British Library Online Contents | 2008

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