Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
A two-dimensional simulation model for the molded underfill process in flip chip packaging
A two-dimensional simulation model for the molded underfill process in flip chip packaging
A two-dimensional simulation model for the molded underfill process in flip chip packaging
Guo, X. R. (Autor:in) / Young, W. B. (Autor:in)
JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY ; 29 ; 2967-2974
01.01.2015
8 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621
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