Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive)

Yim, B.-S. / Kim, J.-M. / Jeon, S.-H. et al. | British Library Online Contents | 2009

Hybrid Interconnection Process Using Solderable ICAs (Isotropic Conductive Adhesives) with Low-Melting-Point Alloy Fillers

Yim, B.-S. / Kim, J.-M. / Jeon, S.-H. et al. | British Library Online Contents | 2009

Influence of Resin Viscosity and Filler Volume on Self-Organized Micro Interconnection

Yasuda, K. / Ohta, K. / Fujimoto, K. | British Library Online Contents | 2006

Formation of a Self-Interconnected Joint using a Low-Melting-Point Alloy Adhesive

Yasuda, K. / Kim, J.-M. / Yasuda, M. et al. | British Library Online Contents | 2004

Characterization of Failure Behaviors in Anisotropic Conductive Interconnection

Kim, J.-W. / Kim, D.-G. / Koo, J.-M. et al. | British Library Online Contents | 2007