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Hybrid Interconnection Process Using Solderable ICAs (Isotropic Conductive Adhesives) with Low-Melting-Point Alloy Fillers
Hybrid Interconnection Process Using Solderable ICAs (Isotropic Conductive Adhesives) with Low-Melting-Point Alloy Fillers
Hybrid Interconnection Process Using Solderable ICAs (Isotropic Conductive Adhesives) with Low-Melting-Point Alloy Fillers
Yim, B.-S. (Autor:in) / Kim, J.-M. (Autor:in) / Jeon, S.-H. (Autor:in) / Lee, S.H. (Autor:in) / Kim, J. (Autor:in) / Han, J.-G. (Autor:in) / Cho, M. (Autor:in)
MATERIALS TRANSACTIONS ; 50 ; 2649-2655
01.01.2009
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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