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Effects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders

Cho, M.G. / Kang, S.K. / Seo, S.-K. / Shih, D.-Y. / Lee, H.M.

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Effects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders

Cho, M.G. / Kang, S.K. / Seo, S.-K. / Shih, D.-Y. / Lee, H.M.

Effects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders

Cho, M.G. / Kang, S.K. / Seo, S.-K. / Shih, D.-Y. / Lee, H.M.

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Zugriff über TIB

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Bestellung bei Subito €

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Titel:

Effects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders

Beteiligte:

Cho, M.G. (Autor:in) / Kang, S.K. (Autor:in) / Seo, S.-K. (Autor:in) / Shih, D.-Y. (Autor:in) / Lee, H.M. (Autor:in)

Erschienen in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 24 ; 534-543

Erscheinungsdatum:

01.01.2009

Format / Umfang:

10 pages

ISSN:

0884-2914

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

Cho, M.G. / Kang, S.K. / Lee, H.M. | British Library Online Contents | 2008

Undercooling, Microstructures and Hardness of Sn-Rich Pb-Free Solders on Cu-xZn Alloy Under Bump Metallurgies

Cho, M.G. / Seo, S.-K. / Lee, H.M. | British Library Online Contents | 2009

Nickel silicon thin film as barrier in under-bump-metallization by magnetron sputtering deposition for Pb-free chip packaging

Li, Y. / Chen, J. / Lazik, C. et al. | British Library Online Contents | 2005

Effect of alloying elements on the creep behavior of high Pb-based solders

Schoeller, H. / Bansal, S. / Knobloch, A. et al. | British Library Online Contents | 2011

Undercooling Behavior and Solidification Microstructure Evolution of Sn-Cu-Ni Solders Modified by Minute Amount of Mixed Rare Earth La-Ce

Zhou, M.B. / Ma, X. / Zhang, X.P. | British Library Online Contents | 2010

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