Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Undercooling, Microstructures and Hardness of Sn-Rich Pb-Free Solders on Cu-xZn Alloy Under Bump Metallurgies
Undercooling, Microstructures and Hardness of Sn-Rich Pb-Free Solders on Cu-xZn Alloy Under Bump Metallurgies
Undercooling, Microstructures and Hardness of Sn-Rich Pb-Free Solders on Cu-xZn Alloy Under Bump Metallurgies
Cho, M.G. (Autor:in) / Seo, S.-K. (Autor:in) / Lee, H.M. (Autor:in)
MATERIALS TRANSACTIONS ; 50 ; 2291-2296
01.01.2009
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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