Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
v Modulus Conductive Adhesives Based on Metallized Polymer Spheres
v Modulus Conductive Adhesives Based on Metallized Polymer Spheres
v Modulus Conductive Adhesives Based on Metallized Polymer Spheres
Kristiansen, H. (Autor:in) / Redford, K. (Autor:in) / Taklo, M.M.V. (Autor:in)
ADVANCING MICROELECTRONICS ; 36 ; 8-11
01.01.2009
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.381
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