SiC-NANOPARTICLE DISPERSED COMPOSITE SOLDER BUMPS FABRICATED BY ELECTROPLATING: Fid-Bau Portal

SiC-NANOPARTICLE DISPERSED COMPOSITE SOLDER BUMPS FABRICATED BY ELECTROPLATING

Shin, Y.-S. / Ko, Y.-K. / Kim, J.-K. / Yoo, S. / Lee, C.-W.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

SiC-NANOPARTICLE DISPERSED COMPOSITE SOLDER BUMPS FABRICATED BY ELECTROPLATING

Shin, Y.-S. / Ko, Y.-K. / Kim, J.-K. / Yoo, S. / Lee, C.-W.

SiC-NANOPARTICLE DISPERSED COMPOSITE SOLDER BUMPS FABRICATED BY ELECTROPLATING

Shin, Y.-S. / Ko, Y.-K. / Kim, J.-K. / Yoo, S. / Lee, C.-W.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Document information

Title:

SiC-NANOPARTICLE DISPERSED COMPOSITE SOLDER BUMPS FABRICATED BY ELECTROPLATING

Contributors:

Shin, Y.-S. (author) / Ko, Y.-K. (author) / Kim, J.-K. (author) / Yoo, S. (author) / Lee, C.-W. (author)

Published in:

SURFACE REVIEW AND LETTERS ; 17 ; 201-205

Publication date:

2010-01-01

Size:

5 pages

ISSN:

0218-625X

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 530.417

Solomon, G. | British Library Online Contents | 2001

Formation of Ag3Sn plates in SnAgCu solder bumps

Gong, J. / Liu, C. / Conway, P. P. et al. | British Library Online Contents | 2010

Nanoparticle-Dispersed Liquid Crystals Fabricated by Sputter Doping

Yoshida, H. / Kawamoto, K. / Kubo, H. et al. | British Library Online Contents | 2010

Microstructural evolution during electromigration in eutectic SnAg solder bumps

Chen, Y. H. / Shao, T. L. / Liu, P. C. et al. | British Library Online Contents | 2005

Reliability analysis of Au-Sn flip-chip solder bump fabricated by co-electroplating

Yoon, J.-W. / Chun, H.-S. / Jung, S.-B. | British Library Online Contents | 2007