Interfacial reactions between SAC405 and SACNG lead-free solders with Au/Ni(P)/Cu substrate reflowed using the CO~2 laser and hot-air methods: Fid-Bau Portal

Interfacial reactions between SAC405 and SACNG lead-free solders with Au/Ni(P)/Cu substrate reflowed using the CO~2 laser and hot-air methods

Yen, Y.-W. / Hsiao, H.-M. / Lo, S.-C. / Fu, S.-M.

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Interfacial reactions between SAC405 and SACNG lead-free solders with Au/Ni(P)/Cu substrate reflowed using the CO~2 laser and hot-air methods

Yen, Y.-W. / Hsiao, H.-M. / Lo, S.-C. / Fu, S.-M.

Interfacial reactions between SAC405 and SACNG lead-free solders with Au/Ni(P)/Cu substrate reflowed using the CO~2 laser and hot-air methods

Yen, Y.-W. / Hsiao, H.-M. / Lo, S.-C. / Fu, S.-M.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

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Ähnliche Titel

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Dokumentinformationen

Titel:

Interfacial reactions between SAC405 and SACNG lead-free solders with Au/Ni(P)/Cu substrate reflowed using the CO~2 laser and hot-air methods

Beteiligte:

Yen, Y.-W. (Autor:in) / Hsiao, H.-M. (Autor:in) / Lo, S.-C. (Autor:in) / Fu, S.-M. (Autor:in)

Erschienen in:

INTERNATIONAL JOURNAL OF MATERIALS RESEARCH ; 104 ; 637-642

Erscheinungsdatum:

01.01.2013

Format / Umfang:

6 pages

ISSN:

1862-5282

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 669.9

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