Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
The influence of strengthening and recrystallization to the cracking behavior of Ni, Sb, Bi alloyed SnAgCu solder during thermal cycling
The influence of strengthening and recrystallization to the cracking behavior of Ni, Sb, Bi alloyed SnAgCu solder during thermal cycling
The influence of strengthening and recrystallization to the cracking behavior of Ni, Sb, Bi alloyed SnAgCu solder during thermal cycling
Zhong, Y. (Autor:in) / Liu, W. (Autor:in) / Wang, C. (Autor:in) / Zhao, X. (Autor:in) / Caers, J. F. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 652 ; 264-270
01.01.2016
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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