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The influence of strengthening and recrystallization to the cracking behavior of Ni, Sb, Bi alloyed SnAgCu solder during thermal cycling
The influence of strengthening and recrystallization to the cracking behavior of Ni, Sb, Bi alloyed SnAgCu solder during thermal cycling
The influence of strengthening and recrystallization to the cracking behavior of Ni, Sb, Bi alloyed SnAgCu solder during thermal cycling
Zhong, Y. (author) / Liu, W. (author) / Wang, C. (author) / Zhao, X. (author) / Caers, J. F. (author)
MATERIALS SCIENCE AND ENGINEERING A ; 652 ; 264-270
2016-01-01
7 pages
Article (Journal)
English
DDC:
620.11
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