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Impact of thermal annealing on Ge-on-Insulator substrate fabricated by wafer bonding
Impact of thermal annealing on Ge-on-Insulator substrate fabricated by wafer bonding
Impact of thermal annealing on Ge-on-Insulator substrate fabricated by wafer bonding
Kang, J. (Autor:in) / Yu, X. (Autor:in) / Takenaka, M. (Autor:in) / Takagi, S. (Autor:in)
Materials science in semiconductor processing ; 42 ; 259-263
01.01.2016
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.38152
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