Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe–Ni Solder Joints
Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe–Ni Solder Joints
Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe–Ni Solder Joints
Zhang, Hao (Autor:in) / Zhu, Qing-Sheng (Autor:in) / Liu, Zhi-Quan (Autor:in) / Zhang, Li (Autor:in) / Guo, Hongyan (Autor:in) / Lai, Chi-Ming (Autor:in)
Journal of materials science & technology ; 30 ; 928-933
01.01.2014
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.1105
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