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    Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe–Ni Solder Joints

    New search for: Zhang, Hao
    New search for: Zhu, Qing-Sheng
    New search for: Liu, Zhi-Quan
    New search for: Zhang, Li
    New search for: Guo, Hongyan
    New search for: Lai, Chi-Ming

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    Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe–Ni Solder Joints

    New search for: Zhang, Hao
    New search for: Zhu, Qing-Sheng
    New search for: Liu, Zhi-Quan
    New search for: Zhang, Li
    New search for: Guo, Hongyan
    New search for: Lai, Chi-Ming

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe–Ni Solder Joints

    New search for: Zhang, Hao
    New search for: Zhu, Qing-Sheng
    New search for: Liu, Zhi-Quan
    New search for: Zhang, Li
    New search for: Guo, Hongyan
    New search for: Lai, Chi-Ming

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe–Ni Solder Joints

    Contributors:

    Zhang, Hao (author) / Zhu, Qing-Sheng (author) / Liu, Zhi-Quan (author) / Zhang, Li (author) / Guo, Hongyan (author) / Lai, Chi-Ming (author)

    Published in:

    Journal of materials science & technology ; 30 ; 928-933

    Publication date:

    2014-01-01

    Size:

    6 pages

    ISSN:

    1005-0302

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1105

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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