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Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Investigation on critical crack-free cutting depth for single crystal silicon slicing with fixed abrasive wire saw based on the scratching machining experiments
Investigation on critical crack-free cutting depth for single crystal silicon slicing with fixed abrasive wire saw based on the scratching machining experiments
Investigation on critical crack-free cutting depth for single crystal silicon slicing with fixed abrasive wire saw based on the scratching machining experiments
Ge, Mengran (Autor:in) / Zhu, Hongtao (Autor:in) / Huang, Chuanzhen (Autor:in) / Liu, Ao (Autor:in) / Bi, Wenbo (Autor:in)
Materials science in semiconductor processing ; 74 ; 261-266
01.01.2018
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.38152
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