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Investigation on critical crack-free cutting depth for single crystal silicon slicing with fixed abrasive wire saw based on the scratching machining experiments
Investigation on critical crack-free cutting depth for single crystal silicon slicing with fixed abrasive wire saw based on the scratching machining experiments
Investigation on critical crack-free cutting depth for single crystal silicon slicing with fixed abrasive wire saw based on the scratching machining experiments
Ge, Mengran (author) / Zhu, Hongtao (author) / Huang, Chuanzhen (author) / Liu, Ao (author) / Bi, Wenbo (author)
Materials science in semiconductor processing ; 74 ; 261-266
2018-01-01
6 pages
Article (Journal)
English
DDC:
621.38152
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