Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Oxide sintered body, sputtering target, and method for producing sputtering target
The invention relates to an oxide sintered body which has a surface having surface roughness Rz of less than 2.0 [mu]m.
本发明涉及一种氧化物烧结体,所述氧化物烧结体的表面的表面粗糙度Rz小于2.0μm。
Oxide sintered body, sputtering target, and method for producing sputtering target
The invention relates to an oxide sintered body which has a surface having surface roughness Rz of less than 2.0 [mu]m.
本发明涉及一种氧化物烧结体,所述氧化物烧结体的表面的表面粗糙度Rz小于2.0μm。
Oxide sintered body, sputtering target, and method for producing sputtering target
氧化物烧结体、溅射靶以及溅射靶的制造方法
KAIJO AKIRA (Autor:in)
19.11.2021
Patent
Elektronische Ressource
Chinesisch
OXIDE SINTERED BODY, SPUTTERING TARGET, AND METHOD FOR PRODUCING SPUTTERING TARGET
Europäisches Patentamt | 2021
|OXIDE SINTERED BODY, SPUTTERING TARGET, AND METHOD FOR PRODUCING SPUTTERING TARGET
Europäisches Patentamt | 2020
|OXIDE SINTERED BODY, SPUTTERING TARGET, AND METHOD FOR PRODUCING SPUTTERING TARGET
Europäisches Patentamt | 2020
|