Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Method for controlling warping degree of copper-clad ceramic substrate mother board
The invention relates to a method for controlling the warping degree of a copper-clad ceramic substrate mother board, and the method comprises the following steps: carrying out the exposure, development and etching of the front and back surfaces of a rectangular mother board in sequence, forming copper foil process edges at the edges of the front and back surfaces, and arranging pattern units in a surrounding region of the copper foil process edges; in the rectangular mother board, the copper foil process edge on the front side comprises four rectangular copper foils which are sequentially connected end to end, and the copper foil process edge on the back side is composed of at least one rectangular copper sheet unit which is arranged at intervals. According to the method, it can be guaranteed that after sintering, the mother boards with different copper thicknesses reach a certain warping value in the copper thinning direction, the reverse pre-bending amount is provided for follow-up welding, and therefore the influence of warping on the copper-clad ceramic substrates with different copper thicknesses is finally reduced.
本发明涉及一种控制覆铜陶瓷基板母板翘曲度的方法，所述方法包括以下步骤：对矩形母板的正反面依次进行曝光、显影和蚀刻后，正面和反面的边缘均形成铜箔工艺边，所述铜箔工艺边的包围区域内设置有图形单元；所述矩形母板中，正面的铜箔工艺边包括四条首尾依次连接的矩形铜箔，反面的铜箔工艺边由至少1个间隔设置的矩形铜片单元构成。本发明提供的方法能够保证烧结后不同铜厚母板向薄铜方向达到一定的翘曲值，为后续焊接提供反向预弯量，从而最终降低翘曲对不同铜厚覆铜陶瓷基板的影响。
Method for controlling warping degree of copper-clad ceramic substrate mother board
The invention relates to a method for controlling the warping degree of a copper-clad ceramic substrate mother board, and the method comprises the following steps: carrying out the exposure, development and etching of the front and back surfaces of a rectangular mother board in sequence, forming copper foil process edges at the edges of the front and back surfaces, and arranging pattern units in a surrounding region of the copper foil process edges; in the rectangular mother board, the copper foil process edge on the front side comprises four rectangular copper foils which are sequentially connected end to end, and the copper foil process edge on the back side is composed of at least one rectangular copper sheet unit which is arranged at intervals. According to the method, it can be guaranteed that after sintering, the mother boards with different copper thicknesses reach a certain warping value in the copper thinning direction, the reverse pre-bending amount is provided for follow-up welding, and therefore the influence of warping on the copper-clad ceramic substrates with different copper thicknesses is finally reduced.
本发明涉及一种控制覆铜陶瓷基板母板翘曲度的方法，所述方法包括以下步骤：对矩形母板的正反面依次进行曝光、显影和蚀刻后，正面和反面的边缘均形成铜箔工艺边，所述铜箔工艺边的包围区域内设置有图形单元；所述矩形母板中，正面的铜箔工艺边包括四条首尾依次连接的矩形铜箔，反面的铜箔工艺边由至少1个间隔设置的矩形铜片单元构成。本发明提供的方法能够保证烧结后不同铜厚母板向薄铜方向达到一定的翘曲值，为后续焊接提供反向预弯量，从而最终降低翘曲对不同铜厚覆铜陶瓷基板的影响。
Method for controlling warping degree of copper-clad ceramic substrate mother board
一种控制覆铜陶瓷基板母板翘曲度的方法
HUANG JIE (Autor:in) / YU XIAODONG (Autor:in) / HENG DONGJIE (Autor:in) / XU SHAN (Autor:in) / YAO LIJUN (Autor:in) / BIAN YIJUN (Autor:in) / ZHANG HUIRAN (Autor:in)
15.11.2024
Patent
Elektronische Ressource
Chinesisch
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