Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Si3N4 ceramic Cu-coated plate and preparation method thereof
The invention relates to the technical field of ceramic surface metallization, in particular to a Si3N4 ceramic Cu-coated plate and a preparation method thereof. Comprising a Si3N4 ceramic plate, an interface bonding layer and an oxygen-free copper layer which are sequentially arranged, the interface bonding layer comprises a filler metal layer and a foamy copper layer, and the filler metal layer is at least located on one side of the foamy copper layer. The filler metal layer and the Si3N4 ceramic react to form a reaction layer to realize connection, the foamy copper layer is arranged between the Si3N4 ceramic plate and the oxygen-free copper layer, the foamy copper middle layer is softened and agglomerated by utilizing the low melting point (779 DEG C) of an AgCu eutectic structure in the filler metal, and a periodic columnar array solid solution structure is formed under the action of tension and is uniformly distributed on a bonding interface; in this way, the periodic columnar array can form a mechanical meshing effect, plastic deformation occurs when an interface is stressed, so that energy in the strain process is absorbed, the bonding strength of the interface is improved, and then the mechanical property of a brazed joint is remarkably improved.
本发明涉及陶瓷表面金属化技术领域，尤其涉及一种Si3N4陶瓷覆Cu板及其制备方法。包括依次放置的Si3N4陶瓷板、界面结合层和无氧铜层，所述界面结合层包括填料金属层、泡沫铜层，所述填料金属层至少位于所述泡沫铜层一侧。通过所述填料金属层与Si3N4陶瓷反应形成反应层实现连接，通过在Si3N4陶瓷板与无氧铜层之间设置泡沫铜层，利用填料金属中AgCu共晶组织熔点较低(779℃)使泡沫铜中间层软化团聚，在张力作用下形成周期性的柱状阵列固溶体结构均匀分布在结合界面，这样周期性的柱状阵列能够形成机械啮合效应，在界面受应力时发生塑性变形从而吸收应变过程中的能量提高界面的结合强度，进而显著提高钎焊接头的力学性能。
Si3N4 ceramic Cu-coated plate and preparation method thereof
The invention relates to the technical field of ceramic surface metallization, in particular to a Si3N4 ceramic Cu-coated plate and a preparation method thereof. Comprising a Si3N4 ceramic plate, an interface bonding layer and an oxygen-free copper layer which are sequentially arranged, the interface bonding layer comprises a filler metal layer and a foamy copper layer, and the filler metal layer is at least located on one side of the foamy copper layer. The filler metal layer and the Si3N4 ceramic react to form a reaction layer to realize connection, the foamy copper layer is arranged between the Si3N4 ceramic plate and the oxygen-free copper layer, the foamy copper middle layer is softened and agglomerated by utilizing the low melting point (779 DEG C) of an AgCu eutectic structure in the filler metal, and a periodic columnar array solid solution structure is formed under the action of tension and is uniformly distributed on a bonding interface; in this way, the periodic columnar array can form a mechanical meshing effect, plastic deformation occurs when an interface is stressed, so that energy in the strain process is absorbed, the bonding strength of the interface is improved, and then the mechanical property of a brazed joint is remarkably improved.
本发明涉及陶瓷表面金属化技术领域，尤其涉及一种Si3N4陶瓷覆Cu板及其制备方法。包括依次放置的Si3N4陶瓷板、界面结合层和无氧铜层，所述界面结合层包括填料金属层、泡沫铜层，所述填料金属层至少位于所述泡沫铜层一侧。通过所述填料金属层与Si3N4陶瓷反应形成反应层实现连接，通过在Si3N4陶瓷板与无氧铜层之间设置泡沫铜层，利用填料金属中AgCu共晶组织熔点较低(779℃)使泡沫铜中间层软化团聚，在张力作用下形成周期性的柱状阵列固溶体结构均匀分布在结合界面，这样周期性的柱状阵列能够形成机械啮合效应，在界面受应力时发生塑性变形从而吸收应变过程中的能量提高界面的结合强度，进而显著提高钎焊接头的力学性能。
Si3N4 ceramic Cu-coated plate and preparation method thereof
一种Si3N4陶瓷覆Cu板及其制备方法
ZHANG JIAN (Autor:in) / WANG YING (Autor:in) / XIAO YONG (Autor:in) / ZHANG RUIZHI (Autor:in) / FENG WEI (Autor:in) / LUO GUOQIANG (Autor:in) / SHEN QIANG (Autor:in)
02.08.2024
Patent
Elektronische Ressource
Chinesisch
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