Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
METHOD FOR MANUFACTURING SUBSTRATE FOR POWER MODULE WITH HEAT SINK
In an aluminum material that constitutes a bonding surface of a metal layer, and an aluminum material that constitutes a bonding surface of a heat sink, any one aluminum material is set to a high-purity aluminum material with high aluminum purity, and the other aluminum material is set to a low-purity aluminum material with low aluminum purity. The difference in a concentration of a contained element other than Al between the high-purity aluminum material and the low-purity aluminum material is set to 1 at% or greater, and the metal layer and the heat sink are subjected to solid-phase diffusion bonding.
METHOD FOR MANUFACTURING SUBSTRATE FOR POWER MODULE WITH HEAT SINK
In an aluminum material that constitutes a bonding surface of a metal layer, and an aluminum material that constitutes a bonding surface of a heat sink, any one aluminum material is set to a high-purity aluminum material with high aluminum purity, and the other aluminum material is set to a low-purity aluminum material with low aluminum purity. The difference in a concentration of a contained element other than Al between the high-purity aluminum material and the low-purity aluminum material is set to 1 at% or greater, and the metal layer and the heat sink are subjected to solid-phase diffusion bonding.
METHOD FOR MANUFACTURING SUBSTRATE FOR POWER MODULE WITH HEAT SINK
VERFAHREN ZUR HERSTELLUNG EINES SUBSTRATS FÜR LEISTUNGSMODUL MIT KÜHLKÖRPER
PROCÉDÉ DE FABRICATION DE SUBSTRAT POUR MODULE DE PUISSANCE À DISSIPATEUR DE CHALEUR
IWAZAKI WATARU (Autor:in) / KOMASAKI MASAHITO (Autor:in)
03.06.2020
Patent
Elektronische Ressource
Englisch
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