Method for manufacturing substrate for power module with heat sink: Fid-Bau Portal

Fachinformationsdienst BAUdigital

Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik

Method for manufacturing substrate for power module with heat sink

IWAZAKI WATARU / KOMASAKI MASAHITO

In an aluminum material that constitutes a bonding surface of a metal layer, and an aluminum material that constitutes a bonding surface of a heat sink, any one aluminum material is set to a high-purity aluminum material with high aluminum purity, and the other aluminum material is set to a low-purity aluminum material with low aluminum purity. The difference in a concentration of a contained element other than Al between the high-purity aluminum material and the low-purity aluminum material is set to 1 at % or greater, and the metal layer and the heat sink are subjected to solid-phase diffusion bonding.

Zugriff

Seitennavigation

Dokumentinformationen

Ähnliche Titel

Exportieren, teilen und zitieren

Method for manufacturing substrate for power module with heat sink

IWAZAKI WATARU / KOMASAKI MASAHITO

In an aluminum material that constitutes a bonding surface of a metal layer, and an aluminum material that constitutes a bonding surface of a heat sink, any one aluminum material is set to a high-purity aluminum material with high aluminum purity, and the other aluminum material is set to a low-purity aluminum material with low aluminum purity. The difference in a concentration of a contained element other than Al between the high-purity aluminum material and the low-purity aluminum material is set to 1 at % or greater, and the metal layer and the heat sink are subjected to solid-phase diffusion bonding.

Method for manufacturing substrate for power module with heat sink

IWAZAKI WATARU / KOMASAKI MASAHITO

In an aluminum material that constitutes a bonding surface of a metal layer, and an aluminum material that constitutes a bonding surface of a heat sink, any one aluminum material is set to a high-purity aluminum material with high aluminum purity, and the other aluminum material is set to a low-purity aluminum material with low aluminum purity. The difference in a concentration of a contained element other than Al between the high-purity aluminum material and the low-purity aluminum material is set to 1 at % or greater, and the metal layer and the heat sink are subjected to solid-phase diffusion bonding.

Zugriff

Seitennavigation

Dokumentinformationen

Ähnliche Titel

Exportieren, teilen und zitieren

Dokumentinformationen

Titel:

Method for manufacturing substrate for power module with heat sink

Beteiligte:

IWAZAKI WATARU (Autor:in) / KOMASAKI MASAHITO (Autor:in)

Erscheinungsdatum:

17.09.2019

Medientyp:

Patent

Format:

Elektronische Ressource

Sprache:

Englisch

Klassifikation:

IPC: H05K PRINTED CIRCUITS , Gedruckte Schaltungen / C04B Kalk , LIME / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES

Ähnliche Titel

SUBSTRATE FOR POWER MODULE WITH HEAT SINK, POWER MODULE WITH HEAT SINK, AND METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE WITH HEAT SINK

TERASAKI NOBUYUKI / NAGATOMO YOSHIYUKI / KUROMITSU YOSHIROU | Europäisches Patentamt | 2021

Freier Zugriff

Power module substrate with heat sink, and method for producing power module substrate with heat sink

NAGATOMO YOSHIYUKI / ISHIZUKA HIROYA / NAGASE TOSHIYUKI et al. | Europäisches Patentamt | 2016

Freier Zugriff

Power module substrate, power module substrate with heat sink, power module, and method of manufacturing power module substrate

KUROMITSU YOSHIROU / NAGATOMO YOSHIYUKI / TERASAKI NOBUYUKI et al. | Europäisches Patentamt | 2015

Freier Zugriff

METHOD FOR MANUFACTURING SUBSTRATE FOR POWER MODULE WITH HEAT SINK

IWAZAKI WATARU / KOMASAKI MASAHITO | Europäisches Patentamt | 2020

Freier Zugriff

POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, AND POWER MODULE

NAGATOMO YOSHIYUKI / TERASAKI NOBUYUKI / KUROMITSU YOSHIROU | Europäisches Patentamt | 2019

Freier Zugriff