Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
COPPER/CERAMIC JOINED BODY, INSULATION CIRCUIT BOARD, COPPER/CERAMIC JOINED BODY PRODUCTION METHOD, AND INSULATION CIRCUIT BOARD MANUFACTURING METHOD
This copper/ceramic bonded body includes a copper member made of copper or a copper alloy, and a ceramic member made of aluminum nitride, in which the copper member and the ceramic member are bonded to each other, and a Mg-O layer is formed at a bonding interface between the copper member and the ceramic member.
COPPER/CERAMIC JOINED BODY, INSULATION CIRCUIT BOARD, COPPER/CERAMIC JOINED BODY PRODUCTION METHOD, AND INSULATION CIRCUIT BOARD MANUFACTURING METHOD
This copper/ceramic bonded body includes a copper member made of copper or a copper alloy, and a ceramic member made of aluminum nitride, in which the copper member and the ceramic member are bonded to each other, and a Mg-O layer is formed at a bonding interface between the copper member and the ceramic member.
COPPER/CERAMIC JOINED BODY, INSULATION CIRCUIT BOARD, COPPER/CERAMIC JOINED BODY PRODUCTION METHOD, AND INSULATION CIRCUIT BOARD MANUFACTURING METHOD
VERBUNDENER KUPFER/KERAMIK-KÖRPER, ISOLATIONSLEITERPLATTE, VERFAHREN ZUR HERSTELLUNG EINES VERBUNDENEN KUPFER/KERAMIK-KÖRPERS UND ISOLATIONSLEITERPLATTENHERSTELLUNGSVERFAHREN
CORPS ASSEMBLÉ CUIVRE/CÉRAMIQUE, CARTE DE CIRCUIT IMPRIMÉ D'ISOLATION, PROCÉDÉ DE PRODUCTION DE CORPS ASSEMBLÉ CUIVRE/CÉRAMIQUE, ET PROCÉDÉ DE FABRICATION DE CARTE DE CIRCUIT IMPRIMÉ D'ISOLATION
TERASAKI NOBUYUKI (Autor:in)
26.07.2023
Patent
Elektronische Ressource
Englisch
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