Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
JOINED BODY, CERAMIC-COPPER CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE
A joined body according to an embodiment is provided with a ceramic substrate, a copper plate and a joint layer. The joint layer is arranged on at least one surface of the ceramic substrate and joins the ceramic substrate and the copper plate to each other. The joint layer contains Ag and Ti. The copper plate includes a first region, a second region and a third region. The first region is separated apart from the joint layer in the thickness direction. The second region is arranged between the joint layer and the first region, and has a higher Ag concentration than that in the first region. The third region is arranged between the joint layer and the second region, and has a lower Ag concentration than that in the second region.
JOINED BODY, CERAMIC-COPPER CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE
A joined body according to an embodiment is provided with a ceramic substrate, a copper plate and a joint layer. The joint layer is arranged on at least one surface of the ceramic substrate and joins the ceramic substrate and the copper plate to each other. The joint layer contains Ag and Ti. The copper plate includes a first region, a second region and a third region. The first region is separated apart from the joint layer in the thickness direction. The second region is arranged between the joint layer and the first region, and has a higher Ag concentration than that in the first region. The third region is arranged between the joint layer and the second region, and has a lower Ag concentration than that in the second region.
JOINED BODY, CERAMIC-COPPER CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE
VERBUNDENER KÖRPER, KERAMIK-KUPFER-LEITERPLATTE UND HALBLEITERBAUELEMENT
CORPS ASSEMBLÉ, CARTE DE CIRCUIT IMPRIMÉ CUIVRE-CÉRAMIQUE ET DISPOSITIF À SEMI-CONDUCTEUR
YONETSU MAKI (Autor:in) / SUENAGA SEIICHI (Autor:in) / FUJISAWA SACHIKO (Autor:in) / SANO TAKASHI (Autor:in)
09.10.2024
Patent
Elektronische Ressource
Englisch
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