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Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
METALLIZED SILICON NITRIDE SUBSTRATE AND METHOD FOR PRODUCING THE SAME
To provide: a metallized silicon nitride substrate in which metal formed by using aluminum as a principal component is metallized with good adhesion onto a surface of a silicon nitride-laminated sintered substrate; and a method for producing the same.SOLUTION: In a metallized silicon nitride substrate, a metallized layer is formed on a surface of a silicon nitride-laminated sintered substrate, the metallized layer comprising aluminum as a principal component; and a layer showing the presence of silicon-silicon bond is formed between the surface of the silicon nitride-laminated sintered substrate and the metallized layer.SELECTED DRAWING: Figure 1
【課題】 窒化ケイ素積層焼結基板表面に、アルミニウムを主成分とする金属を密着性良くメタライズした、メタライズド窒化ケイ素基板、および、その製造方法を提供する。【解決手段】窒化ケイ素積層焼結基板面上に、アルミニウムを主成分とするメタライズ層が形成され、且つ、前記窒化ケイ素積層焼結基板面と前記メタライズ層との間に、ケイ素−ケイ素結合の存在を示す層が形成された、メタライズド窒化ケイ素基板にする。【選択図】図１
METALLIZED SILICON NITRIDE SUBSTRATE AND METHOD FOR PRODUCING THE SAME
To provide: a metallized silicon nitride substrate in which metal formed by using aluminum as a principal component is metallized with good adhesion onto a surface of a silicon nitride-laminated sintered substrate; and a method for producing the same.SOLUTION: In a metallized silicon nitride substrate, a metallized layer is formed on a surface of a silicon nitride-laminated sintered substrate, the metallized layer comprising aluminum as a principal component; and a layer showing the presence of silicon-silicon bond is formed between the surface of the silicon nitride-laminated sintered substrate and the metallized layer.SELECTED DRAWING: Figure 1
【課題】 窒化ケイ素積層焼結基板表面に、アルミニウムを主成分とする金属を密着性良くメタライズした、メタライズド窒化ケイ素基板、および、その製造方法を提供する。【解決手段】窒化ケイ素積層焼結基板面上に、アルミニウムを主成分とするメタライズ層が形成され、且つ、前記窒化ケイ素積層焼結基板面と前記メタライズ層との間に、ケイ素−ケイ素結合の存在を示す層が形成された、メタライズド窒化ケイ素基板にする。【選択図】図１
METALLIZED SILICON NITRIDE SUBSTRATE AND METHOD FOR PRODUCING THE SAME
メタライズド窒化ケイ素基板およびメタライズド窒化ケイ素基板の製造方法
KANEUCHI YOSHIO (Autor:in)
30.07.2020
Patent
Elektronische Ressource
Japanisch
IPC:
C04B
Kalk
,
LIME
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
/
H05K
PRINTED CIRCUITS
,
Gedruckte Schaltungen
Process for producing metallized substrate, and metallized substrate
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CONDUCTIVE COMPOSITION, METALLIZED SUBSTRATE, AND METHODS FOR PRODUCING THE SAME
| Europäisches Patentamt | 2020