Seebeck Coefficient of Ge-on-Insulator Layers Fabricated by Direct Wafer Bonding Process: Fid-Bau Portal

Seebeck Coefficient of Ge-on-Insulator Layers Fabricated by Direct Wafer Bonding Process

Manimuthu, V. / Yoshida, S. / Suzuki, Y. / Salleh, F. / Arivanandhan, M. / Kamakura, Y. / Hayakawa, Y. / Ikeda, H.

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Seebeck Coefficient of Ge-on-Insulator Layers Fabricated by Direct Wafer Bonding Process

Manimuthu, V. / Yoshida, S. / Suzuki, Y. / Salleh, F. / Arivanandhan, M. / Kamakura, Y. / Hayakawa, Y. / Ikeda, H.

Seebeck Coefficient of Ge-on-Insulator Layers Fabricated by Direct Wafer Bonding Process

Manimuthu, V. / Yoshida, S. / Suzuki, Y. / Salleh, F. / Arivanandhan, M. / Kamakura, Y. / Hayakawa, Y. / Ikeda, H.

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Title:

Seebeck Coefficient of Ge-on-Insulator Layers Fabricated by Direct Wafer Bonding Process

Contributors:

Manimuthu, V. (author) / Yoshida, S. (author) / Suzuki, Y. (author) / Salleh, F. (author) / Arivanandhan, M. (author) / Kamakura, Y. (author) / Hayakawa, Y. (author) / Ikeda, H. (author)

Conference:

Inter Academia (International conference)

Published in:

Inter Academia (International conference) ; 94-97

Advanced materials research ; 1117

Publication date:

2015-01-01

Size:

4 pages

ISSN:

1022-6680

Type of media:

Conference paper

Type of material:

Language:

English

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