Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Influence of Substrate Deformations on the Thermal Fatigue Life of SMT Solder Joints
Influence of Substrate Deformations on the Thermal Fatigue Life of SMT Solder Joints
Influence of Substrate Deformations on the Thermal Fatigue Life of SMT Solder Joints
Zafran, J. B. (Autor:in) / Sandor, B. I. (Autor:in)
JOURNAL OF TESTING AND EVALUATION ; 21 ; 346
01.01.1993
346 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC:
620
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