Investigation of Subsurface Damage Depth of Single Crystal Silicon in Electroplated Wire Saw Slicing: Fid-Bau Portal

Investigation of Subsurface Damage Depth of Single Crystal Silicon in Electroplated Wire Saw Slicing

Gao, Y.F. / Ge, P.Q. / Li, S.J.

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Investigation of Subsurface Damage Depth of Single Crystal Silicon in Electroplated Wire Saw Slicing

Gao, Y.F. / Ge, P.Q. / Li, S.J.

Investigation of Subsurface Damage Depth of Single Crystal Silicon in Electroplated Wire Saw Slicing

Gao, Y.F. / Ge, P.Q. / Li, S.J.

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Investigation of Subsurface Damage Depth of Single Crystal Silicon in Electroplated Wire Saw Slicing

Contributors:

Gao, Y.F. (author) / Ge, P.Q. (author) / Li, S.J. (author) / Zhao, B. / Xu, X. / Cai, G. / Kang, R.

Published in:

Advances in Grinding and Abrasive Technology XV ; 306-310

KEY ENGINEERING MATERIALS ; 416

Publication date:

2009-01-01

Size:

5 pages

ISSN:

1013-9826

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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