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    Patterning of copper for multilevel metallization: reactive ion etching and chemical-mechanical polishing

    New search for: Steinbruechel, C.
    New search for: Gessner, T
    New search for: Schulz, S. E.

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    Patterning of copper for multilevel metallization: reactive ion etching and chemical-mechanical polishing

    New search for: Steinbruechel, C.
    New search for: Gessner, T
    New search for: Schulz, S. E.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Patterning of copper for multilevel metallization: reactive ion etching and chemical-mechanical polishing

    New search for: Steinbruechel, C.
    New search for: Gessner, T
    New search for: Schulz, S. E.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Check availability in my library
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    Document information
    Similar titles

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    Document information
    Title:

    Patterning of copper for multilevel metallization: reactive ion etching and chemical-mechanical polishing

    Contributors:

    Steinbruechel, C. (author) / Gessner, T / Schulz, S. E.

    Published in:

    Materials for Advanced Metallization ; 139-146

    APPLIED SURFACE SCIENCE ; 91

    Publication date:

    1996-01-01

    Size:

    8 pages

    ISSN:

    0169-4332

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621.35

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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