Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Ternary amorphous metallic thin films as diffusion barriers for Cu metallization

    New search for: Nicolet, M.-A.
    New search for: Gessner, T.
    New search for: Schulz, S. E.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Ternary amorphous metallic thin films as diffusion barriers for Cu metallization

    New search for: Nicolet, M.-A.
    New search for: Gessner, T.
    New search for: Schulz, S. E.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Ternary amorphous metallic thin films as diffusion barriers for Cu metallization

    New search for: Nicolet, M.-A.
    New search for: Gessner, T.
    New search for: Schulz, S. E.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Ternary amorphous metallic thin films as diffusion barriers for Cu metallization

    Contributors:

    Nicolet, M.-A. (author) / Gessner, T. / Schulz, S. E.

    Published in:

    Materials for Advanced Metallization ; 269-276

    APPLIED SURFACE SCIENCE ; 91

    Publication date:

    1996-01-01

    Size:

    8 pages

    ISSN:

    0169-4332

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621.35

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Chemical Vapor Deposition of Cr-Based Thin Films as Diffusion Barriers in Copper Metallization

    Maury, F. / Gasqueres, C. / Duminica, F.-D. et al. | British Library Online Contents | 2003

    Ultrathin Diffusion Barriers/Liners for Gigascale Copper Metallization

    Kaloyeros, A. E. / Eisenbraun, E. | British Library Online Contents | 2000

    Effect of Heat Treatment on TiN Diffusion Barriers in Copper Thin Film Metallization on PI Substrates

    Yangqiu, L. / Tongxiang, L. / Zhiqiang, F. | British Library Online Contents | 2004

    Thermal and electrical stability of TaN x diffusion barriers for Cu metallization

    Dalili, N. / Liu, Q. / Ivey, D. G. | British Library Online Contents | 2013

    Diffusion in amorphous metallic alloys

    Frank, W. / Hoerner, A. / Scharwaechter, P. et al. | British Library Online Contents | 1994

    Back to top