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Chemical Vapor Deposition of Cr-Based Thin Films as Diffusion Barriers in Copper Metallization
Chemical Vapor Deposition of Cr-Based Thin Films as Diffusion Barriers in Copper Metallization
Chemical Vapor Deposition of Cr-Based Thin Films as Diffusion Barriers in Copper Metallization
Maury, F. (author) / Gasqueres, C. (author) / Duminica, F.-D. (author) / Ossola, F. (author)
MATERIALS SCIENCE FORUM ; 426/432 ; 3439-3444
2003-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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