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Silicon-to-indium tin oxide coated glass bonding for packaging of field emission arrays fabricated on silicon wafer
Silicon-to-indium tin oxide coated glass bonding for packaging of field emission arrays fabricated on silicon wafer
Silicon-to-indium tin oxide coated glass bonding for packaging of field emission arrays fabricated on silicon wafer
Choi, W. B. (author) / Ju, B. K. (author) / Lee, Y. H. (author) / Oh, M. H. (author) / Lee, N. Y. (author) / Sung, M. Y. (author)
JOURNAL OF MATERIALS SCIENCE ; 34 ; 4711-4718
1999-01-01
8 pages
Article (Journal)
English
DDC:
620.11
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