Silicon to Silicon Wafer Bonding at Low Temperature Using Residual Stress Controlled Evaporated Glass Thin Film: Fid-Bau Portal

Silicon to Silicon Wafer Bonding at Low Temperature Using Residual Stress Controlled Evaporated Glass Thin Film

Park, J. S. / Choi, Y. S. / Kang, S. G.

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Silicon to Silicon Wafer Bonding at Low Temperature Using Residual Stress Controlled Evaporated Glass Thin Film

Park, J. S. / Choi, Y. S. / Kang, S. G.

Silicon to Silicon Wafer Bonding at Low Temperature Using Residual Stress Controlled Evaporated Glass Thin Film

Park, J. S. / Choi, Y. S. / Kang, S. G.

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Check availability in my library

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Document information

Title:

Silicon to Silicon Wafer Bonding at Low Temperature Using Residual Stress Controlled Evaporated Glass Thin Film

Contributors:

Park, J. S. (author) / Choi, Y. S. (author) / Kang, S. G. (author) / Kim, H. S. / Li, Y. B. / Lee, S. W.

Published in:

Eco-Materials Processing & Design VII: Proceedings of the Conference of the 7^t^h International Symposium on Eco-Materials Processing & Design January 8-11, 2006, Chengdu, China ; 1054-1057

MATERIALS SCIENCE FORUM ; 510/511

Publication date:

2006-01-01

Size:

4 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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