Large-depth defect profiling in GaAs wafers after saw cutting: Fid-Bau Portal

Large-depth defect profiling in GaAs wafers after saw cutting

Borner, F. / Eichler, S. / Polity, A. / Krause-Rehberg, R. / Hammer, R. / Jurisch, M.

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Large-depth defect profiling in GaAs wafers after saw cutting

Borner, F. / Eichler, S. / Polity, A. / Krause-Rehberg, R. / Hammer, R. / Jurisch, M.

Large-depth defect profiling in GaAs wafers after saw cutting

Borner, F. / Eichler, S. / Polity, A. / Krause-Rehberg, R. / Hammer, R. / Jurisch, M.

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Check availability in my library

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Document information

Title:

Large-depth defect profiling in GaAs wafers after saw cutting

Contributors:

Borner, F. (author) / Eichler, S. (author) / Polity, A. (author) / Krause-Rehberg, R. (author) / Hammer, R. (author) / Jurisch, M. (author)

Published in:

APPLIED SURFACE SCIENCE ; 149 ; 151-158

Publication date:

1999-01-01

Size:

8 pages

ISSN:

0169-4332

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.35

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