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    Challenges of electromigration - Electromigration degradation mechanisms in copper dual-inlaid interconnects -

    New search for: Zschech, E.
    New search for: Meyer, M. A.
    New search for: Grafe, M.
    New search for: Schneider, G.

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    Challenges of electromigration - Electromigration degradation mechanisms in copper dual-inlaid interconnects -

    New search for: Zschech, E.
    New search for: Meyer, M. A.
    New search for: Grafe, M.
    New search for: Schneider, G.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Challenges of electromigration - Electromigration degradation mechanisms in copper dual-inlaid interconnects -

    New search for: Zschech, E.
    New search for: Meyer, M. A.
    New search for: Grafe, M.
    New search for: Schneider, G.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Challenges of electromigration - Electromigration degradation mechanisms in copper dual-inlaid interconnects -

    Contributors:

    Zschech, E. (author) / Meyer, M. A. (author) / Grafe, M. (author) / Schneider, G. (author)

    Published in:

    MATERIALPRUFUNG ; 46 ; 513-516

    Publication date:

    2004-01-01

    Size:

    4 pages

    ISSN:

    0025-5300

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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