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    Effects of static thermal aging and thermal cycling on the microstructure and shear strength of Sn~9~5~.~5Ag~3~.~8Cu~0~.~7 solder joints

    New search for: Ahat, S.
    New search for: Sheng, M.
    New search for: Luo, L.

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    Effects of static thermal aging and thermal cycling on the microstructure and shear strength of Sn~9~5~.~5Ag~3~.~8Cu~0~.~7 solder joints

    New search for: Ahat, S.
    New search for: Sheng, M.
    New search for: Luo, L.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effects of static thermal aging and thermal cycling on the microstructure and shear strength of Sn~9~5~.~5Ag~3~.~8Cu~0~.~7 solder joints

    New search for: Ahat, S.
    New search for: Sheng, M.
    New search for: Luo, L.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Effects of static thermal aging and thermal cycling on the microstructure and shear strength of Sn~9~5~.~5Ag~3~.~8Cu~0~.~7 solder joints

    Contributors:

    Ahat, S. (author) / Sheng, M. (author) / Luo, L. (author)

    Published in:

    JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 16 ; 2914-2921

    Publication date:

    2001-01-01

    Size:

    8 pages

    ISSN:

    0884-2914

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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