Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Influence of solid-state interfacial reactions on the tensile strength of Cu/electroless Ni-P/Sn-3.5Ag solder joint

    New search for: Kumar, A.
    New search for: Chen, Z.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Influence of solid-state interfacial reactions on the tensile strength of Cu/electroless Ni-P/Sn-3.5Ag solder joint

    New search for: Kumar, A.
    New search for: Chen, Z.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Influence of solid-state interfacial reactions on the tensile strength of Cu/electroless Ni-P/Sn-3.5Ag solder joint

    New search for: Kumar, A.
    New search for: Chen, Z.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Influence of solid-state interfacial reactions on the tensile strength of Cu/electroless Ni-P/Sn-3.5Ag solder joint

    Contributors:

    Kumar, A. (author) / Chen, Z. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A ; 423 ; 175-179

    Publication date:

    2006-01-01

    Size:

    5 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Interfacial Reaction of Electroless Ni-P Plating with Sn-3.5Ag (-Co) Solder

    Nishikawa, H. / Komatsu, A. / Takemoto, T. | British Library Online Contents | 2008

    Interfacial microstructure and joint strength of Sn-3.5Ag-X (X = Cu, In, Ni) solder joint

    Choi, W. K. / Kim, J. H. / Jeong, S. W. et al. | British Library Online Contents | 2002

    Initial interfacial reaction layers formed in Sn-3.5Ag solder/electroless Ni-P plated Cu substrate system

    Kang, H.-B. / Lee, J.-W. / Bae, J.-H. et al. | British Library Online Contents | 2008

    Correlation between mechanical tensile properties and microstructure of eutectic Sn-3.5Ag solder

    Yeung, B. / Jang, J. W. | British Library Online Contents | 2002

    Interfacial Reaction and Shear Strength of Pb-Free Sn-3.5Ag/Ni BGA Solder Joints during Reflow

    Yoon, J. W. / Kim, S. W. / Jung, S. B. | British Library Online Contents | 2005

    Back to top