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Damage of lead-free solder joints in flip chip assemblies subjected to high-temperature thermal cycling

Amalu, E. H. / Ekere, N. N.

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Damage of lead-free solder joints in flip chip assemblies subjected to high-temperature thermal cycling

Amalu, E. H. / Ekere, N. N.

Damage of lead-free solder joints in flip chip assemblies subjected to high-temperature thermal cycling

Amalu, E. H. / Ekere, N. N.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

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Document information

Title:

Damage of lead-free solder joints in flip chip assemblies subjected to high-temperature thermal cycling

Contributors:

Amalu, E. H. (author) / Ekere, N. N. (author)

Published in:

COMPUTATIONAL MATERIALS SCIENCE ; 65 ; 470-484

Publication date:

2012-01-01

Size:

15 pages

ISSN:

0927-0256

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.1 / 510

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