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    Microstructure and Mechanical Properties of Sn-0.7Cu Flip Chip Solder Bumps Using Stencil Printing Method

    New search for: Kim, D.-G.
    New search for: Jung, S.-B.

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    Microstructure and Mechanical Properties of Sn-0.7Cu Flip Chip Solder Bumps Using Stencil Printing Method

    New search for: Kim, D.-G.
    New search for: Jung, S.-B.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Microstructure and Mechanical Properties of Sn-0.7Cu Flip Chip Solder Bumps Using Stencil Printing Method

    New search for: Kim, D.-G.
    New search for: Jung, S.-B.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

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    Document information
    Title:

    Microstructure and Mechanical Properties of Sn-0.7Cu Flip Chip Solder Bumps Using Stencil Printing Method

    Contributors:

    Kim, D.-G. (author) / Jung, S.-B. (author)

    Published in:

    Special Issue on Lead-Free Soldering in Electronics III ; 2366-2371

    MATERIALS TRANSACTIONS ; 46

    Publication date:

    2005-01-01

    Size:

    6 pages

    ISSN:

    1345-9678

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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