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Effects of molybdenum, silver dopants and a titanium substrate layer on copper film metallization
Effects of molybdenum, silver dopants and a titanium substrate layer on copper film metallization
Effects of molybdenum, silver dopants and a titanium substrate layer on copper film metallization
Ko, Y. K. (author) / Jang, J. H. (author) / Lee, S. (author) / Yang, H. J. (author) / Lee, W. H. (author) / Reucroft, P. J. (author) / Lee, J. G. (author)
JOURNAL OF MATERIALS SCIENCE ; 38 ; 217-222
2003-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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