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    Packaging Options for MEMS Devices

    New search for: Jung, E.

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    Packaging Options for MEMS Devices

    New search for: Jung, E.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Packaging Options for MEMS Devices

    New search for: Jung, E.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Packaging Options for MEMS Devices

    Contributors:

    Jung, E. (author)

    Published in:

    MRS BULLETIN- MATERIALS RESEARCH SOCIETY ; 28 ; 51-54

    Publication date:

    2003-01-01

    Size:

    4 pages

    ISSN:

    0883-7694

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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